{"id": "CVE-2024-45557", "cveTags": [], "metrics": {"cvssMetricV31": [{"type": "Primary", "source": "
[email protected]", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 7.8, "attackVector": "LOCAL", "baseSeverity": "HIGH", "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "LOW", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 1.8}]}, "published": "2025-04-07T11:15:50.020", "references": [{"url": "https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html", "tags": ["Vendor Advisory"], "source": "
[email protected]"}], "vulnStatus": "Analyzed", "weaknesses": [{"type": "Primary", "source": "
[email protected]", "description": [{"lang": "en", "value": "CWE-823"}]}], "descriptions": [{"lang": "en", "value": "Memory corruption can occur when TME processes addresses from TZ and MPSS requests without proper validation."}, {"lang": "es", "value": "La corrupci\u00f3n de memoria puede ocurrir cuando TME procesa direcciones de solicitudes TZ y MPSS sin la validaci\u00f3n adecuada."}], "lastModified": "2025-08-19T17:16:21.603", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": "C88B9C86-2E8E-4DCE-A30C-02977CC00F00"}], "operator": "OR"}, {"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:*", "vulnerable": false, "matchCriteriaId": "EE473A5A-5CFC-4F08-A173-30717F8BD0D7"}], "operator": "OR"}], "operator": "AND"}, {"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*", 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