{"id": "CVE-2024-43059", "cveTags": [], "metrics": {"cvssMetricV31": [{"type": "Primary", "source": "
[email protected]", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 7.8, "attackVector": "LOCAL", "baseSeverity": "HIGH", "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "LOW", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 1.8}]}, "published": "2025-03-03T11:15:12.140", "references": [{"url": "https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html", "tags": ["Patch", "Vendor Advisory"], "source": "
[email protected]"}], "vulnStatus": "Analyzed", "weaknesses": [{"type": "Primary", "source": "
[email protected]", "description": [{"lang": "en", "value": "CWE-416"}]}], "descriptions": [{"lang": "en", "value": "Memory corruption while invoking IOCTL calls from the use-space for HGSL memory node."}, {"lang": "es", "value": "Corrupci\u00f3n de memoria al invocar llamadas IOCTL desde el espacio de uso para el nodo de memoria HGSL."}], "lastModified": "2025-03-06T17:44:58.433", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sa8770p_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": "781CCC31-C08F-499B-BE73-6C7DB70437AF"}], "operator": "OR"}, {"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:sa8770p:*:*:*:*:*:*:*:*", "vulnerable": false, "matchCriteriaId": "14725E0A-2BF4-42DC-BCC2-EED9BF685FF6"}], "operator": "OR"}], "operator": "AND"}, {"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sa8775p_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": 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